Shallow Junction Photodiode for Detecting Short Wavelength Light

ABSTRACT

The present invention is a photodiode or photodiode array having improved ruggedness for a shallow junction photodiode which is typically used in the detection of short wavelengths of light. In one embodiment, the photodiode has a relatively deep, lightly-doped P zone underneath a P+ layer. By moving the shallow junction to a deeper junction in a range of 2-5 μm below the photodiode surface, the improved device has improved ruggedness, is less prone to degradation, and has an improved linear current.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present specification is a continuation of U.S. patent applicationSer. No. 13/749,616, of the same title, and filed on Jan. 24, 2013,which is herein incorporated by reference in its entirety.

FIELD

The present specification relates generally to the field of radiationdetectors, and in particular, to a shallow junction photodiode havingimproved device performance characteristics. Specifically, the presentspecification discloses photodiodes having a doping profile P+P N N+shallow junction for use in short wavelength light applications such asin CT scanning, X-ray scanning, and other light detection operations.

BACKGROUND

Active solid-state semiconductor devices, and in particular, siliconphotodiodes, are among the most popular photodetectors having asufficiently high performance over a large wavelength range and asufficient ease of use. Silicon photodiodes are sensitive to light inthe wide spectral range, extending from deep ultraviolet through visibleto near infrared, which is approximately 200 nm to 1100 nm. Siliconphotodiodes, by using their ability to detect the presence or absence ofminute light intensities, facilitate the precise measurement of theseminute light intensities upon appropriate calibration. For example,appropriately calibrated silicon photodiodes detect and measure lightintensities varying over a wide range, from very minute lightintensities of below 10⁻¹³ watts/cm² to high intensities above 10⁻³watts/cm².

Silicon photodiodes can be employed in an assortment of applicationsincluding, but not limited to, spectroscopy, distance and speedmeasurement, laser ranging, laser guided missiles, laser alignment andcontrol systems, optical free air communication, optical radar,radiation detection, optical position encoding, film processing, flamemonitoring, scintillator read out, environmental applications such asspectral monitoring of earth ozone layer and pollution monitoring, lowlight-level imaging, such as night photography, nuclear medical imaging,photon medical imaging, and multi-slice computer tomography (CT)imaging, security screening and threat detection, thin photochipapplications, and a wide range of computing applications.

Typically, photodiode arrays employ a scintillator material forabsorbing high energy (ionizing) electromagnetic or charged particleradiation, which, in response, fluoresces photons at a characteristicwavelength. Scintillators are defined by their light output (number ofemitted photons per unit absorbed energy) short fluorescence decaytimes, and optical transparency at wavelengths of their own specificemission energy. The lower the decay time of a scintillator, that is,the shorter the duration of its flashes of fluorescence are, the lessso-called “dead time” the detector will have and the more ionizingevents per unit of time it will be able to detect. Scintillators areused to detect electromagnetic waves or particles in many security anddetection systems, including CT, X-ray, and gamma ray. There, ascintillator converts the energy to light of a wavelength which can bedetected by photomultiplier tubes (PMTs) or P− N junction photodiodes.

Photodiodes are typically characterized by certain parameters, such as,among others, electrical characteristics, optical characteristics,current characteristics, voltage characteristics, and noise. Electricalcharacteristics predominantly comprise shunt resistance, seriesresistance, junction capacitance, rise or fall time and/or frequencyresponse. Optical characteristics comprise responsivity, quantumefficiency, non-uniformity, and/or non-linearity. Photodiode noise maycomprise, among others, thermal noise, quantum, photon or shot noise,and/or flicker noise.

Conventional shallow junction photodiodes are prone to junctiondegradation and yield loss during assembly due to a very shallow P+Njunction, which is typically 0.3 μm. Therefore, what is needed is aphotodiode that has improved ruggedness and is less prone to degradationor failure during assembly of scintillator crystals, thereby improvingyield and reducing cost. What is also needed is a photodiode having animproved linear current.

SUMMARY

The present specification is directed toward a photodiode having a topsurface defined by at least one SiO₂ layer comprising: a low resistivitysubstrate; a high resistivity silicon layer positioned atop the lowresistivity substrate and below the top surface of the photodiode; afirst P doped zone within the high resistivity silicon layer, whereinthe first P doped zone has a thickness of 2-5 μm; a first P+ doped zonepositioned between the top of the first P doped zone and the top of thephotodiode.

In one embodiment, the low resistivity substrate has a thickness in arange of 150 μm to 350 μm. In one embodiment, the low resistivitysubstrate is doped n+.

In one embodiment, the high resistivity silicon layer has a thickness ina range of 10 μm to 100 μm. In one embodiment, the high resistivitysilicon layer is doped n.

In one embodiment, the first P+ doped zone and a portion of the first Pdoped zone is surrounded by P+ doped ring.

In one embodiment, the photodiode further comprises a first N+ regionextending throughout the thickness of the high resistivity siliconlayer. In one embodiment, the photodiode further comprises a second N+region extending throughout the thickness of the high resistivitysilicon layer, wherein the second N+ region is separated from the firstN+ region by a third region and wherein the first P doped zone and firstP+ doped zone is located in the third region. In one embodiment, thephotodiode further comprises a third N+ region extending throughout thethickness of the high resistivity silicon layer, wherein the third N+region is separated from the second N+ region by a fourth region. In oneembodiment, the photodiode further comprises a second P doped zonewithin said fourth region in the high resistivity silicon layer, whereinthe second P doped zone has a thickness of 2-5 μm. In one embodiment,the photodiode further comprises a second P+ doped zone positionedbetween the top of the second P doped zone and the top of the photodiodein the fourth region.

In one embodiment, all of the first P+ doped zone and a portion of thefirst P doped zone is surrounded by P+ doped ring. In one embodiment,all of the second P+ doped zone and a portion of the second P doped zoneis surrounded by P+ doped ring.

In one embodiment, the photodiode further comprises an anode and acathode on the top surface of the photodiode.

In one embodiment, the photodiode further comprises an anode on the topsurface of the photodiode and a cathode on a backside of the photodiode.

In one embodiment, the photodiode further comprises an anode on the topsurface of the photodiode, a cathode on the top surface of thephotodiode, and a cathode on a backside of the photodiode.

The present specification is also directed toward a method offabricating a photodiode on a substrate wafer having a high resistivitysilicon layer front side and a low resistivity silicon substrate backside, said method comprising the steps of: providing an oxide layer onthe front side of the wafer; implementing an etching process on thefront side to define a first plurality of regions on the front side;filling the first plurality of regions with n+ dopant; depositing anoxide layer on the front side of the wafer; implementing a secondetching process on the front side to define a second plurality ofregions on the front side; filling the second plurality of regions witha p dopant; depositing an oxide layer on the front side of the wafer;performing a deep drive-in process to redistribute p dopant atoms anddeposit them deeper into the wafer creating deep p active areas;implementing a third etching process on the front side to define a thirdplurality of regions on the front side, wherein the third plurality ofregions is on a right side and a left side of each deep p active area;forming deep p+ ring zones in each of the third plurality of regions;depositing an oxide layer on the front side of the wafer; forming ananti-reflective layer on the front side and the back side of the wafer;forming shallow p+ active area regions on the front side of the wafer,on top of the deep p active area regions; forming at least one contactwindow on the wafer; and performing a metal deposition process todeposit metal on the device wafer, wherein said metal deposition processcreates connections and wherein said metal deposition process forms areflective metal shield.

In one embodiment, the metal deposition process is performed on thefront side of the wafer to form both a cathode and an anode and on theback side to form an anode.

In another embodiment, the metal deposition process is performed on thefront side of the wafer to form both an anode and a cathode on the frontside, forming contacts only on the front side of the device.

In another embodiment, the metal deposition process is performed on thefront side of the wafer to form an anode and on the back side of thewafer to form a cathode, forming contacts only on the back side of thedevice.

In one embodiment, the metal used for depositing metal on the front sidefor both the anode and cathode is aluminum and the metal used forforming the cathode on the backside is a Cr/Au alloy, forming contactson both the front side and the back side of the device.

The present specification is also directed toward a photodiode having atop surface defined by at least one SiO₂ layer comprising: a highresistivity bulk wafer positioned below the top surface of thephotodiode; a first P doped zone within the high resistivity bulk wafer,wherein the first P doped zone has a thickness of 2-5 μm; a first P+doped zone positioned between the top of the first P doped zone and thetop of the photodiode.

In one embodiment, the high resistivity bulk wafer has a thickness in arange of 250 μm to 400 μm.

In one embodiment, the first P+ doped zone and a portion of the first Pdoped zone is surrounded by P+ doped ring.

In one embodiment, the photodiode further comprises a first N+ regionextending throughout the thickness of the high resistivity bulk wafer.In one embodiment, the photodiode further comprises a second N+ regionextending throughout the thickness of the high resistivity bulk wafer,wherein the second N+ region is separated from the first N+ region by athird region and wherein the first P doped zone and first P+ doped zoneis located in the third region. In one embodiment, the photodiodefurther comprises a third N+ region extending throughout the thicknessof the high resistivity bulk wafer, wherein the third N+ region isseparated from the second N+ region by a fourth region. In oneembodiment, the photodiode further comprises a second P doped zonewithin said fourth region in the high resistivity bulk wafer, whereinthe second P doped zone has a thickness of 2-5 μm. In one embodiment,the photodiode further comprises a second P+ doped zone positionedbetween the top of the second P doped zone and the top of the photodiodein the fourth region.

In one embodiment, all of the first P+ doped zone and a portion of thefirst P doped zone is surrounded by P+ doped ring. In one embodiment,all of the second P+ doped zone and a portion of the second P doped zoneis surrounded by P+ doped ring.

In one embodiment, the photodiode further comprises an anode and acathode on the top surface of the photodiode.

In another embodiment, the photodiode further comprises an anode on thetop surface of the photodiode and a cathode on a backside of thephotodiode.

In another embodiment, the photodiode further comprises an anode on thetop surface of the photodiode, a cathode on the top surface of thephotodiode, and a cathode on a backside of the photodiode.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features and advantages of the present specificationwill be appreciated, as they become better understood by reference tothe following detailed description when considered in connection withthe accompanying drawings wherein:

FIG. 1 illustrates a photodiode device, in accordance with an embodimentof the present specification;

FIG. 2 illustrates a cross-sectional view of a substrate wafer used as astarting material in one embodiment of the manufacture of the photodiodeof the present specification;

FIG. 3 illustrates a cross-sectional view of the wafer shown in FIG. 2,after a mask oxidation process step, in one embodiment of themanufacture of the photodiode of the present specification;

FIG. 4 illustrates a cross-sectional view of the wafer shown in FIG. 3,after a n+ photolithography process step, in one embodiment of themanufacture of the photodiode of the present specification;

FIG. 5 illustrates a cross-sectional view of the wafer shown in FIG. 4,after a n+ diffusion process step, in one embodiment of the manufactureof the photodiode of the present specification;

FIG. 6 illustrates a cross-sectional view of the wafer shown in FIG. 5,after an etching and lithography process step, in one embodiment of themanufacture of the photodiode of the present specification;

FIG. 7 illustrates a cross-sectional view of the wafer shown in FIG. 6,after a boron implant and annealing process step, in one embodiment ofthe manufacture of the photodiode of the present specification;

FIG. 8 illustrates a cross-sectional view of the wafer shown in FIG. 7,after a p diffusion process step, in one embodiment of the manufactureof the photodiode of the present specification;

FIG. 9 illustrates a cross-sectional view of the wafer shown in FIG. 8,after an etching and deep ring p+ masking process step, in oneembodiment of the manufacture of the photodiode of the presentspecification;

FIG. 10 illustrates a cross-sectional view of the wafer shown in FIG. 9,after an etching process step, in one embodiment of the manufacture ofthe photodiode of the present specification;

FIG. 11 illustrates a cross-sectional view of the wafer shown in FIG.10, after a process for growing oxide and nitride layers on a front andbackside step, in one embodiment of the manufacture of the photodiode ofthe present specification;

FIG. 12 illustrates a cross-sectional view of the wafer shown in FIG.11, after a boron implant and annealing process step for forming shallowp₊ active areas, in one embodiment of the manufacture of the photodiodeof the present specification;

FIG. 13 is a cross-sectional view of the wafer shown in FIG. 12,illustrating a manufacturing step for a photodiode having both top andbottom contact devices whereby the wafer is subjected to an etchingprocess, in one embodiment of the manufacture of the photodiode of thepresent specification;

FIG. 14 is a cross-sectional view of the wafer shown in FIG. 13,illustrating a manufacturing step for a photodiode having both top andbottom contact devices whereby the wafer is subjected to a metal maskingprocess, in one embodiment of the manufacture of the photodiode of thepresent specification;

FIG. 15 is a cross-sectional view of the wafer shown in FIG. 14,illustrating manufacturing step for a photodiode having both top andbottom contact devices whereby the wafer is subjected to an additionalmetal masking process, in one embodiment of the manufacture of thephotodiode of the present specification;

FIG. 16 is a cross-sectional view of the wafer shown in FIG. 12,illustrating a manufacturing step for a photodiode having top contactsonly whereby the wafer is subjected to an etching process, in oneembodiment of the manufacture of the photodiode of the presentspecification;

FIG. 17 is a cross-sectional view of the wafer shown in FIG. 16,illustrating a manufacturing step for a photodiode having top contactsonly whereby the wafer is subjected to a metal masking process, in oneembodiment of the manufacture of the photodiode of the presentspecification;

FIG. 18 is a cross-sectional view of the wafer shown in FIG. 17,illustrating a manufacturing step for a photodiode having top contactsonly whereby the wafer is subjected to an additional metal maskingprocess, in one embodiment of the manufacture of the photodiode of thepresent specification;

FIG. 19 is a cross-sectional view of the wafer shown in FIG. 12,illustrating a manufacturing step for a photodiode having bottomcontacts only whereby the wafer is subjected to an etching process, inone embodiment of the manufacture of the photodiode of the presentspecification;

FIG. 20 is a cross-sectional view of the wafer shown in FIG. 19,illustrating a manufacturing step for a photodiode having bottomcontacts only whereby the wafer is subjected to a metal masking process,in one embodiment of the manufacture of the photodiode of the presentspecification; and

FIG. 21 is a cross-sectional view of the wafer shown in FIG. 20,illustrating a manufacturing step for a photodiode having bottomcontacts only whereby the wafer is subjected to an additional metalmasking process, in one embodiment of the manufacture of the photodiodeof the present specification;

FIG. 22 illustrates a photodiode device, without a deep p ring, inaccordance with another embodiment of the present specification;

FIG. 23 illustrates a cross-sectional view of a substrate wafer used asa starting material for the manufacture of the photodiode without a deepp ring in accordance with one embodiment the present specification;

FIG. 24 illustrates a cross-sectional view of the wafer shown in FIG.23, after a mask oxidation process step, for the manufacture of thephotodiode without a deep p ring in accordance with one embodiment thepresent specification;

FIG. 25 illustrates a cross-sectional view of the wafer shown in FIG.24, after a n+ photolithography process step, for the manufacture of thephotodiode without a deep p ring in accordance with one embodiment thepresent specification;

FIG. 26 illustrates a cross-sectional view of the wafer shown in FIG.25, after a n+ diffusion process step, for the manufacture of thephotodiode without a deep p ring in accordance with one embodiment thepresent specification;

FIG. 27 illustrates a cross-sectional view of the wafer shown in FIG.26, after an etching and lithography process step, for the manufactureof the photodiode without a deep p ring in accordance with oneembodiment the present specification;

FIG. 28 illustrates a cross-sectional view of the wafer shown in FIG.27, after a boron implant and annealing process step, for themanufacture of the photodiode without a deep p ring in accordance withone embodiment the present specification;

FIG. 29 illustrates a cross-sectional view of the wafer shown in FIG.28, after a p diffusion process step, for the manufacture of thephotodiode without a deep p ring in accordance with one embodiment thepresent specification;

FIG. 30 illustrates a cross-sectional view of the wafer shown in FIG.29, after a process for growing oxide and nitride layers on a front andbackside step, for the manufacture of the photodiode without a deep pring in accordance with one embodiment the present specification;

FIG. 31 illustrates a cross-sectional view of the wafer shown in FIG.30, after a boron implant and annealing process step for forming shallowp₊ active areas, in one embodiment of the manufacture of the photodiodeof the present specification;

FIG. 32 is a cross-sectional view of the wafer shown in FIG. 31,illustrating a manufacturing step for a photodiode having bottomcontacts only whereby the wafer is subjected to an etching process, forthe manufacture of the photodiode without a deep p ring in accordancewith one embodiment the present specification;

FIG. 33 is a cross-sectional view of the wafer shown in FIG. 32,illustrating a manufacturing step for a photodiode having bottomcontacts only whereby the wafer is subjected to a metal masking process,for the manufacture of the photodiode without a deep p ring inaccordance with one embodiment the present specification; and

FIG. 34 is a cross-sectional view of the wafer shown in FIG. 33,illustrating a manufacturing step for a photodiode having bottomcontacts only whereby the wafer is subjected to an additional metalmasking process, for the manufacture of the photodiode without a deep pring in accordance with one embodiment the present specification;

FIG. 35 is a cross-sectional view of the wafer shown in FIG. 31,illustrating a manufacturing step for a photodiode having top contactsonly whereby the wafer is subjected to an etching process, for themanufacture of the photodiode without a deep p ring in accordance withone embodiment the present specification;

FIG. 36 is a cross-sectional view of the wafer shown in FIG. 35,illustrating a manufacturing step for a photodiode having top contactsonly whereby the wafer is subjected to a metal masking process, for themanufacture of the photodiode without a deep p ring in accordance withone embodiment the present specification;

FIG. 37 is a cross-sectional view of the wafer shown in FIG. 36,illustrating a manufacturing step for a photodiode having top contactsonly whereby the wafer is subjected to an additional metal maskingprocess, for the manufacture of the photodiode without a deep p ring inaccordance with one embodiment the present specification;

FIG. 38 is a cross-sectional view of the wafer shown in FIG. 31,illustrating a manufacturing step for a photodiode having both top andbottom contact devices whereby the wafer is subjected to an etchingprocess, for the manufacture of the photodiode without a deep p ring inaccordance with one embodiment the present specification;

FIG. 39 is a cross-sectional view of the wafer shown in FIG. 38,illustrating a manufacturing step for a photodiode having both top andbottom contact devices whereby the wafer is subjected to a metal maskingprocess, for the manufacture of the photodiode without a deep p ring inaccordance with one embodiment the present specification;

FIG. 40 is a cross-sectional view of the wafer shown in FIG. 39,illustrating manufacturing step for a photodiode having both top andbottom contact devices whereby the wafer is subjected to an additionalmetal masking process, for the manufacture of the photodiode without adeep p ring in accordance with one embodiment the present specification;

FIG. 41 illustrates a photodiode fabricated on a bulk wafer material, inaccordance with an embodiment of the present specification; and

FIG. 42 illustrates a photodiode fabricated on a bulk wafer material, inaccordance with an embodiment of the present specification.

DETAILED DESCRIPTION

The present specification describes a photodiode having improved devicecharacteristics, such as low capacitance, low dark current, improvedsignal-to-noise ratio, and lower fabrication and manufacturing costs.

In order to improve the ruggedness of the device, especially whenscintillator crystals are mounted on the photodiodes, a new structure isprovided whereby a lowly doped, deep P-zone is introduced underneath theshallow P+ layer. Thus, the PN junction is moved deep down underneaththe silicon-oxide interface yielding photodiodes with increasedruggedness and stability.

While the present specification is described in detail with respect toan individual photodiode element, it should be understood to those ofordinary skill in the art that a plurality of such photodiode elementsmay be aggregated on a substrate to form a multi-element photodiodearray. Further, while the photodiode and photodiode array of presentspecification is described with respect to p+ diffused active areas onan n-type silicon wafer, it should be noted and understood by those ofordinary skill in the art that the present specification can be designedand manufactured with reverse polarity, and more specifically, n+diffused active areas on p-type silicon substrate wafers. Thus, thepresent specification is not limited to the polarity presented herein.

The present specification is directed towards multiple embodiments. Thefollowing disclosure is provided in order to enable a person havingordinary skill in the art to practice the invention. Language used inthis specification should not be interpreted as a general disavowal ofany one specific embodiment or used to limit the claims beyond themeaning of the terms used therein. The general principles defined hereinmay be applied to other embodiments and applications without departingfrom the spirit and scope of the invention. Also, the terminology andphraseology used is for the purpose of describing exemplary embodimentsand should not be considered limiting. Thus, the present specificationis to be accorded the widest scope encompassing numerous alternatives,modifications and equivalents consistent with the principles andfeatures disclosed. For purpose of clarity, details relating totechnical material that is known in the technical fields related to theinvention have not been described in detail so as not to unnecessarilyobscure the present invention.

In one embodiment, the present specification is directed towards ashallow junction photodiode characterized by a doping profile P+ P N N+used in the detection of short wavelength light such as that employed inCT scanning, X-ray scanning, etc.

A conventional structure of a shallow junction photodiode having a P+ NN+ profile comprises a shallow p+ region. In order to improve theruggedness of a photodiode, especially when scintillator crystals aremounted on the photodiode, a new structure is provided whereby a lowlydoped and deep P-zone is introduced underneath the shallow P+ layer.

The present specification provides a photodiode having improvedruggedness, stability and performance characteristics. The photodiode ofthe present specification is advantageous in that it provides improvedruggedness for a shallow junction photodiode which is typically used inthe detection of short wavelengths of light. By the introduction of arelatively deep, lightly doped P zone underneath the P+ layer of aconventional shallow junction photodiode, the shallow junction(typically 0.3 μm deep) is moved to a deeper junction (on the order of2-5 μm deep). This causes the improved photodiode to have a higherlinear current since the integrated total boron dose of the P+ P layeris higher than the only P+ layer of a conventional shallow junctionphotodiode. Further, the improved, rugged photodiode of the presentspecification results in improved yield and reduced cost, since thephotodiode is less prone to degradation and/or failure on shuntresistance during assembly of scintillator crystals.

In one embodiment, the improved P+ P N N+ photodiode device of thepresent specification is front-side illuminated. In one embodiment, thephotodiode has bottom contacts only, wherein the anode is on the frontside and the cathode is on the back side. In another embodiment, thephotodiode has top contacts only, wherein the anode and cathode are onthe top side. In yet another embodiment, the photodiode has both top andbottom contacts, wherein the anode is on the front side and the cathodeis on both the front side and backside. In the cases where the deviceshave bottom contacts, a metal is also provided on the backside so that acontact can be made with the cathode on the backside. In one embodiment,the metal employed on the front side is aluminum. In one embodiment, themetal employed on the backside to create contacts is a Cr/Au alloy.

FIG. 1 illustrates a photodiode, in accordance with an embodiment of thepresent specification. The photodiode 100 comprises substrate waferstarting material further comprising a high resistivity silicon layer102 on top of a relatively low resistivity wafer 104, which, in oneembodiment is a silicon, n-type wafer (n+). In an embodiment, theresistivity of the silicon layer 102 ranges from 10 ohm cm to 10,000 ohmcm and that of the silicon n-type wafer 104 ranges from 0.001 ohm cm to0.1 ohm cm. In an embodiment, the low resistivity substrate has athickness in a range of 150 μm to 650 μm, and the high resistivitysilicon layer has a thickness in a range of 10 μm to 100 μm. Thus, theoverall thickness of the silicon substrate starting material ranges from250 μm to 750 μm.

The photodiode 100 represents a two element array and further comprisesa mask oxide layer 106 deposited on top of the silicon layer 102. Themask oxide layer 106 comprises silicon oxide (SiO₂) and/or siliconnitride (Si₃N₄), whereby thermal oxidation is employed to achieve themask oxidation. In one embodiment, the oxide layer 106 comprises SiO₂having a thickness of approximately 8,000 Å. In one embodiment the SiO₂layer defines a top surface of the photodiode 100.

The photodiode also comprises three n+ diffused zones 108 below the topsurface of the photodiode 100 and positioned within the high resistivitysilicon layer 102, on an extreme right edge and an extreme left edge, aswell as in the center of the photodiode 100.

In multi-element photodiode arrays, crosstalk occurs as carriersgenerated in one element migrate to adjacent elements and causecrosstalk. The n+ diffused zones 108 function like a barrier, reflectingminority carriers and thus, do not let the minority carriers migrate toadjacent elements. In order to have a maximum blocking effect, the n+diffused zones 108 need to extend to the low resistivity substrate layer102, however, since there is a tradeoff with long diffusion time andcost, in an embodiment, while n+ diffused zones 108 are made deep, theydo not extend all the way to the low resistivity substrate layer 102. Inanother embodiment, the three n+ diffused zones 108 are separated fromeach other and each n+ zone has a thickness extending through the entiredepth of the low resistivity silicon layer 102.

The photodiode 100 further comprises two p diffused regions 110positioned within the high resistivity silicon layer 102 as illustratedin FIG. 1. In an embodiment, the p diffused regions 110 have a thicknessof approximately 2-5 μm. Also, in an embodiment, each p diffused region110 is positioned between two n+ diffused regions 108. The photodiode100 further comprises two shallow p+ diffused zones or regions 112positioned within the high resistivity silicon layer 102 and directly ontop of the p diffused regions 110 and below the top layer of thephotodiode as illustrated in FIG. 1. In an embodiment, the depth of theshallow p+ zones 112 is approximately 0.3 μm.

In an embodiment, the p+ diffused zones 112 and a portion of the p dopedzones is surrounded by p+ doped rings 114.

In one embodiment, as shown in FIGS. 1 and 19-21, the photodiode 100further comprises anodes 116 on the top surface of the photodiode and acathode 118 on a backside of the photodiode 100.

In another embodiment, the photodiode 100 comprises an anode on the topsurface of the photodiode, a cathode on the top surface of thephotodiode, and a cathode on a backside of the photodiode, asillustrated and described in greater detail with respect to FIGS. 13-15.

In yet another embodiment, the photodiode 100 comprises anodes and acathode on the top surface of the photodiode, as is illustrated anddescribed in greater detail with respect to FIGS. 16-18.

FIGS. 2 through 21 depict cross-sectional views of exemplarymanufacturing steps of the photodiode of the present specification.

Referring now to FIG. 2, the starting material of the photodiode is adevice wafer 200 comprising a high resistivity silicon layer 202 on topof a relatively low resistivity wafer 204, which, in one embodiment, isa silicon, n-type wafer. In an embodiment, the resistivity of thesilicon layer 202 ranges from 10 ohm cm to 10,000 ohm cm and that of thesilicon n type wafer 204 ranges from 0.001 ohm cm to 0.1 ohm cm. In anembodiment, the device wafer 200 has an overall thickness ranging from250-750 μm and the silicon layer 202 has a thickness ranging from 10-100μm. While it is preferred that the device wafer 200 be comprised ofsilicon, one of ordinary skill in the art would appreciate that anysuitable semiconductor material, which can be processed in accordancewith the manufacturing steps of the present specification, may be used.It should be understood by those of ordinary skill in the art, however,that the above specifications are not binding and that the type ofmaterial and resistivity can easily be changed to suit the design,fabrication, and functional requirements of the present specification.

Referring to FIG. 3, the silicon layer 202 is subjected to a standardmask oxidation process for growing a mask oxide layer 306 on the siliconlayer 202. In one embodiment, the mask oxide layer 306 comprises siliconoxide (SiO₂) and/or silicon nitride (Si₃N₄), and thermal oxidation isemployed to achieve mask oxidation. In one embodiment, the oxide layer306 comprises SiO₂ having a thickness of approximately 8,000 Å. Standardmask oxidation is well known to those of ordinary skill in the art andwill not be described in further detail herein.

As shown in FIG. 4, after the standard mask oxidation is complete, thedevice wafer 200 is subjected to n+ photolithography. After selecting asuitable material and creating a suitable photoresist pattern, a thinphotoresist layer is applied to the front and back side of device wafer200 to etch the pattern on the surfaces of the wafer. Generally, thephotoresist layer is a photosensitive polymeric material forphotolithography and photoengraving that can form a patterned coating ona surface. In one embodiment, the photoresist layer is applied via aspin coating technique. Spin coating is well known to those of ordinaryskill in the art and will not be described in detail herein.

Next, the photoresist-coated device wafer 200 is aligned with an n+mask. N+ masking techniques are employed to protect portions of devicewafer 200. Generally, photographic masks are high precision platescontaining microscopic images of preferred pattern or electroniccircuits. They are typically fabricated from flat pieces of quartz orglass with a layer of chrome on one side. The mask geometry is etched inthe chrome layer. In one embodiment, the n+ mask comprises a pluralityof diffusion windows with appropriate geometrical and dimensionalspecifications. The n+ mask allows selective irradiation of thephotoresist on the device wafer. Regions that are exposed to radiationare removed while those that are protected from diffusion remainshielded by the n+ mask.

An intense light, such as UV light, is projected through the mask,exposing portions of the photoresist layer in the pattern of the n+mask. The exposed and remaining photoresist is then subjected to asuitable chemical or plasma etching process to reveal the patterntransfer from the mask to the photoresist layer. In one embodiment, thedevice wafer 200 is subjected to oxide etching to remove portions 408,410 of the silicon dioxide layer 306.

Next as shown in FIG. 5 the device wafer 200 is subjected to n+diffusion followed by drive-in oxidation after the previous n+ maskingand etching steps. Generally, diffusion facilitates propagation of adiffusing material through a host material. An appropriate amount ofdopant atoms, such as phosphorous, is deposited onto the device wafer200 and fills the gaps left by the removed photoresist layer. Then, thewafer 200 is subjected to a drive-in oxidation process that is used toredistribute the dopant atoms and deposit them deeper into the wafer. Inone embodiment, this process fills the regions 408, 410, via deepdiffusion, with n+ dopant 511. In an embodiment, the width of the n+diffused zones ranges from approximately 0.143 to 0.278 μm. In anembodiment, the n+ diffused zones are optional and are not present inthe photodiode. The presence of the n+ diffused reduces surface leakagecurrent and crosstalk, but will increases a furnace processing time.Therefore, inclusion of n+ deep diffused zones is a tradeoff betweendevice performance and processing cost.

Next, the regions 408, 410 are covered with oxide layer 512. In oneembodiment, oxide layer 512 has a thickness of approximately 4,000 Å.

Next as shown in FIG. 6 device wafer 200 is subjected to a lithographyprocess, creating deep p diffused regions 614. In an embodiment, theexposed silicon surface of region 614 is approximately 1.75 μm wide andis subsequently oxidized. As with any conventional lithography process,p lithography comprises at least the following tasks, but not limited tosuch tasks: substrate preparation; photoresist application; soft baking;mask alignment; exposure;

development; hard backing; and etching. In addition, various otherchemical treatments may be performed.

The p masking and diffusion process is similar to that delineated withrespect to the n+ masking process described earlier and will not berepeated in detail herein. The p masking process further comprisesdeposition and deep drive-in oxidation, allowing for predefined and/orpredetermined thermal budget in accord with the principles of thepresent specification.

This is followed by boron implant and annealing, as shown in FIG. 7, toform a shallow p active area 716. Next, the regions 716 are covered withan oxide layer.

Next, as shown in FIG. 8 device wafer 200 is subjected to p diffusionfollowed by drive-in oxidation after the previous p masking and etchingsteps. An appropriate amount of dopant atoms, such as phosphorous, isdeposited onto the substrate wafer and fills the gaps left by theremoved photoresist layer. Then, the wafer 200 is subjected to adrive-in oxidation process that is used to redistribute the dopant atomsand deposit them deeper into the wafer creating deep p active areas 818.In an embodiment, the depth of the p type dopant ranges between 2 to 5μm.

FIG. 9 illustrates the step of subjecting the device wafer 200 toetching and deep ring p+ masking process in order to create p+ deep ringzones 920, which are then covered with an oxide layer. The p+ deep ringzones 920 are created in order to ensure that the contact metal will notpunch through the junction and degrade the dark current. In anembodiment, the photodiode of the present invention does not include p+deep ring zones 920, described in greater detail below.

Next as shown in FIGS. 10 and 11 respectively, oxide layers covering thedeep p active areas 818 are etched and layers of oxide such as siliconoxide 1122 and silicon nitride 1124 are grown on a front side 1126 and abackside 1128 of the wafer device 200. In an embodiment, the oxide layer1122 has a thickness of approximately 150 Å and the nitride layer 1124has a thickness of approximately 300 Å, forming an anti-reflective layeron the device wafer.

This is followed by boron implant and annealing, as shown in FIG. 12, toform shallow p₊ active areas 1230. In an embodiment, the depth of theshallow p+ areas 1230 is approximately 0.3 μm. Thus, the PN junction ismoved deep down underneath the oxide interface rendering the photodiodesincreased ruggedness and stability, because when crystals are mounted onthe surface of the silicon photodiode, it increases the likelihood ofmechanical abrasion, scratches, etc. introduced on the silicon surface,resulting in degradation.

The improved P+ P N N+ junction photodiode of the present specificationis front-side illuminated. The photodiode may be designed as having: topcontacts with an anode and a cathode on a front/top side of the waferdevice 200, or bottom contact with an anode on a front side and acathode on a back side of the wafer device 200, or else both top andbottom contact devices with an anode on a front side, and a cathode onboth front and back side of the wafer device 200.

FIGS. 13, 14, and 15 illustrate manufacturing steps for designing aphotodiode having both top and bottom contact devices with an anode on afront side, and a cathode on both front and back side of the waferdevice 200. Once shallow p+ active area 1230 is formed as illustrated inFIG. 12, the wafer device 200 is subjected to a contact masking process.As shown in FIG. 13, the nitride layer 1124 and the oxide layer 1122 areetched away from a front side 1126 and a backside 1128 of the waferdevice 200. Contact mask areas 1332 approximately 0.02 μm wide areformed on the front side 1332. Next, as shown in FIGS. 14 and 15, thewafer device 200 is subjected to metal masking. A metal layer 1434 isdeposited on the front side 1126 to form a cathode 1536 and an anode1538 and on the back side to form a cathode 1540. In variousembodiments, the metal used for forming the cathode and anode on thefront side is aluminum; whereas that used for forming the cathode on thebackside is a Cr/Au alloy. In various embodiments, analuminum/nickel/gold alloy may be used for forming the cathode and anodeon the front and backside of the photodiode. In other embodiments, atitanium/palladium/silver alloy may be used for forming the cathode andanode on the front and backside of the photodiode

FIGS. 16, 17 and 18 illustrate manufacturing steps for fabricating aphotodiode having top contacts with an anode and a cathode on afront/top side of the wafer device 200. Once shallow p+ active area 1230is formed as illustrated in FIG. 12, the wafer device 200 is subjectedto a contact masking process. The nitride layer 1124 and the oxide layer1122 are etched away from a front side 1332 of the wafer device 200.Referring to FIG. 16, contact mask areas 1642 approximately 0.02 μm wideare formed on the front side 1332. Next as shown in FIGS. 17 and 18, thewafer device 200 is subjected to metal masking. A metal layer 1744 isdeposited on the front side 1332 to form a cathode 1846 and an anode1848. In various embodiments, the metal used for forming the cathode andanode on the front side is aluminum.

FIGS. 19, 20 and 21 illustrate manufacturing steps for fabricating aphotodiode having bottom contact with an anode on a front side and acathode on a back side of the wafer device 200. Once shallow p+ activearea 1230 is formed as illustrated in FIG. 12, the wafer device 200 issubjected to a contact masking process. The nitride layer 1324 and theoxide layer 1322 are etched off from a front side 1332 of the waferdevice 200. Contact mask areas 1950 approximately 0.02 μm wide areformed on the front side 1332, as anode contacts are to be present onthe front side. Next as shown in FIGS. 20 and 21, the wafer device 200is subjected to metal masking. A metal layer 2052 is deposited on thefront side 1332 to form an anode 2154 and on the backside to form acathode 2156. In various embodiments, the metal used for forming thecathode on the back side is a backside is a Cr/Au alloy.

Conventional shallow junction photodiodes comprise deep p+ ring zones onwhich the anode metal contacts are located. During an aluminum-siliconalloying process (also called a sintering process), which is usuallyperformed at approximately 425° C. for approximately 20 minutes,aluminum reacts with silicon and provides the photodiode device with agood ohmic contact. However, during the sintering process, aluminumpenetrates the p+ shallow layer of the photodiode and may reach thedepletion region, causing high dark currents in the photodiode. In orderto avoid this, aluminum contact pads are placed on the deep p+ ringzones.

In an alternate embodiment of the present invention, a photodiode ismanufactured without having a deep p+ ring zone. Since, the photodiodeof the present invention comprises a deep p zone underneath a shallow pzone, the pn junction is now located a few microns below the surface,and aluminum cannot penetrate a few microns below to reach the depletionregion. The photodiode without deep p+ rings, in one embodiment, hasbottom contacts only, wherein an anode is provided on the front side ofthe photodiode and a cathode is provided on the back side. In anotherembodiment, the photodiode without deep p+ rings has top contacts only,wherein both anode and cathode are provided on the front side of thephotodiode. In yet another embodiment, the photodiode without deep p+rings has both top and bottom contacts, wherein an anode is provided onthe front side and a cathode on both the front side and back side. Inthe cases where the photodiodes have bottom contacts, a metal is alsoprovided on the back side so that a contact may be made with the cathodeon the back side. In one embodiment, the metal employed on the frontside is aluminum and, the metal employed on the back side to createcontacts is a Chromium/Gold (Cr/Au) alloy.

FIG. 22 illustrates a photodiode without a deep p ring, in accordancewith an embodiment of the present specification. The photodiode 2200comprises substrate wafer starting material further comprising a highresistivity silicon layer 2202 on top of a relatively low resistivitywafer 2204, which, in one embodiment is a silicon, n-type wafer (n+). Inan embodiment, the resistivity of the silicon layer 2202 ranges from 10ohm cm to 10,000 ohm cm and that of the silicon n-type wafer 2204 rangesfrom 0.001 ohm cm to 0.1 ohm cm. In an embodiment, the low resistivitysubstrate has a thickness in a range of 150 μm to 350 μm, and the highresistivity silicon layer has a thickness in a range of 10 μm to 100 μm.Thus, the overall thickness of the silicon substrate starting materialranges from 250 μm to 400 μm.

The photodiode 2200 further comprises a mask oxide layer 2206 depositedon top of the silicon layer 2202. The mask oxide layer 2206 comprisessilicon oxide (SiO₂) and/or silicon nitride (Si₃N₄), whereby thermaloxidation is employed to achieve the mask oxidation. In one embodiment,the oxide layer 2206 comprises SiO₂ having a thickness of approximately4,000 Å. In one embodiment the SiO₂ layer defines a top surface of thephotodiode 2200.

The photodiode also comprises three n+ diffused zones 2208 below the topsurface of the photodiode 2200 and positioned within the highresistivity silicon layer 2202, on an extreme right edge and an extremeleft edge, as well as in the center of the photodiode 2200. In anembodiment, the three n+ diffused zones 2208 are separated from eachother and each n+ zone has a thickness extending through the entiredepth of the silicon layer 2202.

The photodiode 2200 further comprises two p diffused regions 2210positioned within the high resistivity silicon layer 2202 as illustratedin FIG. 22. In an embodiment, the p diffused regions 2210 have athickness of approximately 2-5 μm. Also, in an embodiment, each pdiffused region 2210 is positioned between two n+ diffused regions 2208.The photodiode 2200 further comprises two shallow p+ diffused zones orregions 2212 positioned within the high resistivity silicon layer 2202and directly on top of the p diffused regions 2210 and below the toplayer of the photodiode as illustrated in FIG. 22. In an embodiment, thedepth of the shallow p+ zones 2212 is approximately 0.3 μm.

In one embodiment, as shown in FIGS. 22 and 32-34, the photodiode 2200further comprises anodes 2214 on the top surface of the photodiode and acathode 2216 on a backside of the photodiode 2200.

In another embodiment, the photodiode 2200 comprises anodes and acathode on the top surface of the photodiode, as is illustrated anddescribed in greater detail with respect to FIGS. 35-37.

In yet another embodiment, the photodiode 2200 comprises an anode on thetop surface of the photodiode, a cathode on the top surface of thephotodiode, and a cathode on a backside of the photodiode, asillustrated and described in greater detail with respect to FIGS. 38-40.

FIGS. 23 through 40 depict cross-sectional views of exemplarymanufacturing steps of the photodiode without deep p+ rings, inaccordance with an embodiment of the present specification.

Referring now to FIG. 23, the starting material of the photodiode is adevice wafer 2300 comprising a high resistivity silicon layer 2302 ontop of a relatively low resistivity wafer 2304, which, in oneembodiment, is a silicon, n-type wafer. In an embodiment, theresistivity of the silicon layer 2302 ranges from 10 ohm cm to 10,000ohm cm and that of the silicon n type wafer 2304 ranges from 0.001 ohmcm to 0.1 ohm cm. In an embodiment, the device wafer 2300 has an overallthickness ranging from 250-400 μm and the silicon layer 2302 has athickness ranging from 10-100 μm. While it is preferred that the devicewafer 2300 be comprised of silicon, one of ordinary skill in the artwould appreciate that any suitable semiconductor material, which can beprocessed in accordance with the manufacturing steps of the presentspecification, may be used. It should be understood by those of ordinaryskill in the art, however, that the above specifications are not bindingand that the type of material and resistivity can easily be changed tosuit the design, fabrication, and functional requirements of the presentspecification.

Referring to FIG. 24, the silicon layer 2302 is subjected to a standardmask oxidation process for growing a mask oxide layer 2406 on thesilicon layer 2302. In one embodiment, the mask oxide layer 2406comprises silicon oxide (SiO₂) and/or silicon nitride (Si₃N₄), andthermal oxidation is employed to achieve mask oxidation. In oneembodiment, the oxide layer 2406 comprises SiO₂ having a thickness ofapproximately 8,000 Å. Standard mask oxidation is well known to those ofordinary skill in the art and will not be described in further detailherein.

As shown in FIG. 25, after the standard mask oxidation is complete, thedevice wafer 2300 is subjected to n+ photolithography. After selecting asuitable material and creating a suitable photoresist pattern, a thinphotoresist layer is applied to the front and back side of device wafer2300 to etch the pattern on the surfaces of the wafer. Generally, thephotoresist layer is a photosensitive polymeric material forphotolithography and photoengraving that can form a patterned coating ona surface. In one embodiment, the photoresist layer is applied via aspin coating technique. Spin coating is well known to those of ordinaryskill in the art and will not be described in detail herein.

Next, the photoresist-coated device wafer 2300 is aligned with an n+mask. N+ masking techniques are employed to protect portions of devicewafer 2300. Generally, photographic masks are high precision platescontaining microscopic images of preferred pattern or electroniccircuits. They are typically fabricated from flat pieces of quartz orglass with a layer of chrome on one side. The mask geometry is etched inthe chrome layer. In one embodiment, the n+ mask comprises a pluralityof diffusion windows with appropriate geometrical and dimensionalspecifications. The n+ mask allows selective irradiation of thephotoresist on the device wafer. Regions that are exposed to radiationare removed while those that are protected from diffusion remainshielded by the n+ mask.

An intense light, such as UV light, is projected through the mask,exposing portions of the photoresist layer in the pattern of the n+mask. The exposed and remaining photoresist is then subjected to asuitable chemical or plasma etching process to reveal the patterntransfer from the mask to the photoresist layer. In one embodiment, thedevice wafer 2300 is subjected to oxide etching to remove portions 2508,2510 of the silicon dioxide layer 2406.

Next as shown in FIG. 26 the device wafer 2300 is subjected is subjectedto a standard mask oxidation process for growing a mask oxide layer 2611on the silicon layer 2302. In one embodiment, the mask oxide layer 2611comprises silicon oxide (SiO₂) and/or silicon nitride (Si₃N₄), andthermal oxidation is employed to achieve mask oxidation. In oneembodiment, the oxide layer 2611 comprises SiO₂ having a thickness ofapproximately 4,000 Å.

Next, referring to FIG. 26 the device wafer 2300 is subjected to n+diffusion followed by drive-in oxidation after the previous n+ maskingand etching steps. Generally, diffusion facilitates propagation of adiffusing material through a host material. An appropriate amount ofdopant atoms, such as phosphorous, is deposited onto the device wafer2300 and fills the gaps left by the removed photoresist layer. Then, thewafer 2300 is subjected to a drive-in oxidation process that is used toredistribute the dopant atoms and deposit them deeper into the wafer. Inone embodiment, this process fills the regions 2508, 2510, via deepdiffusion, with n+ dopant 2612. In an embodiment, the width of the n+diffused zones ranges from approximately 0.143 to 0.278 μm. In anembodiment, the n+ diffused zones are optional may not be present in thephotodiode.

Next, the regions 2508, 2510 are covered with oxide layer 2613. In oneembodiment, oxide layer 2613 has a thickness of approximately 4,000 Å.

Next, as shown in FIG. 27, in a preferred embodiment, the device wafer2300 is subjected to n+ masking and etching and n+ diffusion to createan n+ layer 2714 on a back side of the photodiode 2300, to provide anohmic contact. In an embodiment, where the resistivity of the substratebeing used to form the photodiode is very low, the n+ layer on thebackside of the photodiode may be omitted. Further, as illustrated inFIG. 27, device wafer 2300 is subjected to a lithography process,creating deep p diffused regions 2715. In an embodiment, the exposedsilicon surface of region 2715 is approximately 1.75 μm wide and issubsequently oxidized. As with any conventional lithography process, plithography comprises at least the following tasks, but not limited tosuch tasks: substrate preparation; photoresist application; soft baking;mask alignment; exposure; development; hard backing; and etching. Inaddition, various other chemical treatments may be performed.

The p masking and diffusion process is similar to that delineated withrespect to the n+ masking process described earlier and will not berepeated in detail herein. The p masking process further comprisesdeposition and deep drive-in oxidation, allowing for predefined and/orpredetermined thermal budget in accord with the principles of thepresent specification.

This is followed by boron implant and annealing, as shown in FIG. 28, toform a shallow p active area 2816. The active area specifications, amongother parameters, comprise significant performance characteristics ofthe photodiode. Next, the regions 2816 are covered with an oxide layer.

Next, as shown in FIG. 29 device wafer 2300 is subjected to p diffusionfollowed by drive-in oxidation after the previous p masking and etchingsteps. An appropriate amount of dopant atoms, such as phosphorous, isdeposited onto the substrate wafer and fills the gaps left by theremoved photoresist layer. Then, the wafer 2300 is subjected to adrive-in oxidation process that is used to redistribute the dopant atomsand deposit them deeper into the wafer creating deep p active areas2918. In an embodiment, the depth of the p type dopant ranges between 2to 5 μm.

Next as shown in FIG. 30 layers of oxide such as silicon oxide 3022 andsilicon nitride 3024 are grown on a front side 1126 and a backside 1128of the wafer device 200. In an embodiment, the oxide layer 3022 has athickness of approximately 150 Å and the nitride layer 3024 has athickness of approximately 300 Å, forming an anti-reflective layer onthe device wafer.

This is followed by boron implant and annealing, as shown in FIG. 31, toform shallow p+ active areas 3126. In an embodiment, the depth of theshallow p+ areas 3126 is approximately 0.3 μm. The implant is formedthrough the silicon oxide 3022 and silicon nitride 3024 dual layer.Thus, the PN junction is moved deep down underneath the oxide interfacerendering the photodiodes increased ruggedness and stability.

The improved P+ P N N+ junction photodiode of the present specificationis front-side illuminated. The photodiode may be designed as having: topcontacts with an anode and a cathode on a front/top side of the waferdevice 2300, or bottom contact with an anode on a front side and acathode on a back side of the wafer device 2300, or else both top andbottom contact devices with an anode on a front side, and a cathode onboth front and back side of the wafer device 2300.

FIGS. 32, 33 and 34 illustrate manufacturing steps for fabricating aphotodiode having bottom contact with an anode on a front side and acathode on a back side of the wafer device 2300. Once shallow p+ activearea 3126 is formed as illustrated in FIG. 31, the wafer device 2300 issubjected to a contact masking process. The nitride layer 3024 and theoxide layer 3022 are etched off from a front side of the wafer device2300. Contact mask areas 3228 approximately 0.02 μm wide are formed onthe front side. Next as shown in FIGS. 33 and 34, the wafer device 2300is subjected to metal masking. A metal layer 3330 is deposited on thefront side to form an anode 3432 and on the backside to form a cathode3434. In various embodiments, the metal used for forming the cathode onthe back side is a backside is a Cr/Au alloy.

FIGS. 35, 36 and 37 illustrate manufacturing steps for fabricating aphotodiode having top contacts with an anode and a cathode on afront/top side of the wafer device 2300. Once shallow p+ active area3126 is formed as illustrated in FIG. 31, the wafer device 2300 issubjected to a contact masking process. The nitride layer 3024 and theoxide layer 3022 are etched away from a front side of the wafer device2300. Referring to FIG. 35, contact mask areas 3536 approximately 0.02μm wide are formed on the front side. Next as shown in FIGS. 36 and 37,the wafer device 2300 is subjected to metal masking. A metal layer 3638is deposited on the front side to form a cathode 3740 and an anode 3742.In various embodiments, the metal used for forming the cathode and anodeon the front side is aluminum.

FIGS. 38, 39, and 40 illustrate manufacturing steps for fabricating aphotodiode having both top and bottom contact devices with an anode on afront side, and a cathode on both front and back side of the waferdevice 2300. Once shallow p+ active area 3126 is formed as illustratedin FIG. 31, the wafer device 2300 is subjected to a contact maskingprocess. The nitride layer 3024 and the oxide layer 3022 are etched awayfrom a front side and a backside of the wafer device 2300. Contact maskareas 3844 approximately 0.02 μm wide are formed on the front side.Next, as shown in FIGS. 39 and 40, the wafer device 2300 is subjected tometal masking. A metal layer 3946 is deposited on the front side to forma cathode 4048 and an anode 4050 and on the back side to form a cathode4052. In various embodiments, the metal used for forming the cathode andanode on the front side is aluminum; whereas that used for forming thecathode on the backside is a Cr/Au alloy.

In an embodiment, the photodiode of the present invention is built on ahigh resistivity bulk wafer material instead of using a high resistivitylayer over a low resistivity silicon wafer as the starting material.While a photodiode built on bulk wafer material is more structurallyrobust and therefore rugged, it has a lower shunt resistance and highercrosstalk when compared with devices made on a substrate having a highresistivity layer over a low resistivity silicon wafer. Typically, shuntresistance is tested as: 10 mV divided by the dark current (as measuredat 10 mV), with respect to a photodiode. In order to obtain a high shuntresistance, the dark current is required to be as low as possible. Darkcurrent, however, is generated throughout the volume of a highresistivity wafer layer. For example, a 250 μm thick high resistivitysilicon bulk wafer generates more dark current than a 10 μm thick highresistivity layer on a 240 μm low resistivity substrate as the darkcurrent generated in the low resistivity substrate is very small andnegligible. In order to achieve low cross-talk on a multi-element array,the N+ region needs to extend throughout to reach the backside of thewafer. This is an expensive procedure as it would take a very long timeto diffuse to have the N+ region 250 μm deep in a case of a 250 μm thickbulk wafer and thus, significantly increases the cost of the photodiodearray.

FIG. 41 illustrates a photodiode fabricated on a bulk wafer material, inaccordance with an embodiment of the present specification. Thephotodiode 4100 comprises bulk wafer starting material 4102 having aresistivity ranging from 10 ohm cm to 10,000 ohm cm. In an embodiment,the bulk wafer material 4102 has a thickness ranging from 250 μm to 400μm.

The photodiode 4102 further comprises a mask oxide layer 4104 comprisingsilicon oxide (SiO₂) and/or silicon nitride (Si₃N₄), whereby thermaloxidation is employed to achieve the mask oxidation. In one embodiment,the oxide layer 2204 comprises SiO₂ having a thickness of approximately4,000 Å. In one embodiment the SiO₂ layer defines a top surface of thephotodiode 4100.

The photodiode also comprises three n+ diffused zones 4106 below the topsurface of the photodiode 4100 and positioned within the bulk wafermaterial 4102, on an extreme right edge and an extreme left edge, aswell as in the center of the photodiode 4100.

The photodiode 4100 further comprises two p diffused regions 4108positioned within the bulk wafer material 4102. In an embodiment, the pdiffused regions 4108 have a thickness of approximately 2-5 μm. Also, inan embodiment, each p diffused region 4108 is positioned between two n+diffused regions 4106. The photodiode 4100 further comprises two shallowp+ diffused zones or regions 4110 positioned directly on top of the pdiffused regions 4108 and below the top layer of the photodiode asillustrated in FIG. 41. In an embodiment, the depth of the shallow p+zones 4110 is approximately 0.3 μm. In one embodiment, as shown in FIG.41 the photodiode 4100 further comprises anodes 4112 on the top surfaceof the photodiode and a cathode 4114 on a backside of the photodiode4100. In another embodiment, the photodiode 4100 comprises both anodesand a cathode on the top surface of the photodiode.

FIG. 42 illustrates a photodiode built on a bulk wafer material, inaccordance with an embodiment of the present specification. Thephotodiode 4200 comprises bulk wafer starting material 4202 having aresistivity ranging from 10 ohm cm to 10,000 ohm cm. In an embodiment,the bulk wafer material 4202 has a thickness ranging from 250 μm to 400μm.

The photodiode 4200 represents a two element array and further comprisesa mask oxide layer 4204 comprising silicon oxide (SiO₂) and/or siliconnitride (Si₃N₄), whereby thermal oxidation is employed to achieve themask oxidation. In one embodiment, the oxide layer 4204 comprises SiO₂having a thickness of approximately 8,000 Å. In one embodiment the SiO₂layer defines a top surface of the photodiode 4200.

The photodiode 4200 also comprises three n+ diffused zones 4206 belowthe top surface of the photodiode 4200 and positioned within the bulkwafer material 4202, on an extreme right edge and an extreme left edge,as well as in the center of the photodiode 4200. In an embodiment, thethree n+ diffused zones 4206 are separated from each other. Thephotodiode 4200 further comprises two p diffused regions 4208 having athickness of approximately 2-5 μm. Also, in an embodiment, each pdiffused region 4208 is positioned between two n+ diffused regions 4206.The photodiode 4200 further comprises two shallow p+ diffused zones orregions 4210 positioned directly on top of the p diffused regions 4206and below the top layer of the photodiode 4200 as illustrated in FIG.42. In an embodiment, the depth of the shallow p+ zones 4210 isapproximately 0.3 μm.

In an embodiment, the p+ diffused zones 4210 and a portion of the pdoped zones 4208 is surrounded by p+ doped rings 4212. In oneembodiment, as shown in FIG. 42 the photodiode 4200 further comprisesanodes 4214 on the top surface of the photodiode 4200 and a cathode 4216on a backside of the photodiode 4200.

The above examples are merely illustrative of the structure andmanufacturing steps of the photodiode array of the presentspecification. Although only a few embodiments of the presentspecification have been described herein, it should be understood thatthe present specification might be embodied in many other specific formswithout departing from the spirit or scope of the invention. Therefore,the present examples and embodiments are to be considered asillustrative and not restrictive, and the invention may be modifiedwithin the scope of the appended claims.

We claim:
 1. A method of fabricating a photodiode on a substrate waferhaving a high resistivity silicon layer front side and a low resistivitysilicon substrate back side, said method comprising the steps of:providing an oxide layer on the front side of the wafer; implementing anetching process on the front side to define a first plurality of regionson the front side; filling the first plurality of regions with n+dopant; depositing an oxide layer on the front side of the wafer;implementing a second etching process on the front side to define asecond plurality of regions on the front side; filling the secondplurality of regions with a p dopant; depositing an oxide layer on thefront side of the wafer; performing a deep drive-in process toredistribute p dopant atoms and deposit them deeper into the wafercreating deep p active areas; implementing a third etching process onthe front side to define a third plurality of regions on the front side,wherein the third plurality of regions is on a right side and a leftside of each deep p active area; forming deep p+ ring zones in each ofthe third plurality of regions; depositing an oxide layer on the frontside of the wafer; forming an anti-reflective layer on the front sideand the back side of the wafer; forming shallow p+ active area regionson the front side of the wafer, on top of the deep p active arearegions; forming at least one contact window on the wafer; andperforming a metal deposition process to deposit metal on the devicewafer, wherein said metal deposition process creates connections andwherein said metal deposition process forms a reflective metal shield.2. The method of claim 1, wherein the metal deposition process isperformed on the front side of the wafer to form both a cathode and ananode and on the back side to form an anode.
 3. The method of claim 1,wherein the metal deposition process is performed on the front side ofthe wafer to form both an anode and a cathode on the front side, formingcontacts only on the front side of the device.
 4. The method of claim 1,wherein the metal deposition process is performed on the front side ofthe wafer to form an anode and on the back side of the wafer to form acathode, forming contacts only on the back side of the device.
 5. Themethod of claim 1 wherein the metal used for depositing metal on thefront side for both the anode and cathode is aluminum and the metal usedfor forming the cathode on the backside is a Cr/Au alloy, formingcontacts on both the front side and the back side of the device.
 6. Aphotodiode having a top surface defined by at least one SiO₂ layercomprising: a. a high resistivity bulk wafer positioned below the topsurface of the photodiode; b. a first P doped zone within the highresistivity bulk wafer, wherein the first P doped zone has a thicknessof 2-5 μm; c. a first P+ doped zone positioned between the top of thefirst P doped zone and the top of the photodiode.
 7. The photodiode ofclaim 6 wherein the high resistivity bulk wafer has a thickness in arange of 250 μm to 400 μm.
 8. The photodiode of claim 6 wherein thefirst P+ doped zone and a portion of the first P doped zone issurrounded by P+ doped ring.
 9. The photodiode of claim 6 furthercomprising a first N+ region extending throughout the thickness of thehigh resistivity bulk wafer.
 10. The photodiode of claim 9 furthercomprising a second N+ region extending throughout the thickness of thehigh resistivity bulk wafer, wherein the second N+ region is separatedfrom the first N+ region by a third region and wherein the first P dopedzone and first P+ doped zone is located in the third region.
 11. Thephotodiode of claim 10 further comprising a third N+ region extendingthroughout the thickness of the high resistivity bulk wafer, wherein thethird N+ region is separated from the second N+ region by a fourthregion.
 12. The photodiode of claim 11 further comprising a second Pdoped zone within said fourth region in the high resistivity bulk wafer,wherein the second P doped zone has a thickness of 2-5 μm.
 13. Thephotodiode of claim 12 further comprising a second P+ doped zonepositioned between the top of the second P doped zone and the top of thephotodiode in the fourth region.
 14. The photodiode of claim 6 whereinall of the first P+ doped zone and a portion of the first P doped zoneis surrounded by P+ doped ring.
 15. The photodiode of claim 13 whereinall of the second P+ doped zone and a portion of the second P doped zoneis surrounded by P+ doped ring.
 16. The photodiode of claim 6 furthercomprising an anode and a cathode on the top surface of the photodiode.17. The photodiode of claim 6 further comprising an anode on the topsurface of the photodiode and a cathode on a backside of the photodiode.18. The photodiode of claim 6 further comprising an anode on the topsurface of the photodiode, a cathode on the top surface of thephotodiode, and a cathode on a backside of the photodiode.